Plasma Uniformity Numerical Modeling of Geometrical Structure for 450 mm Wafer Process System
نویسندگان
چکیده
منابع مشابه
An Improved Dispatching Method (a-HPDB) for Automated Material Handling System with Active Rolling Belt for 450 mm Wafer Fabrication
The semiconductor industry is facing the transition from 300 mm to 450 mm wafer fabrication. Due to the increased size and weight, 450 mm wafers will pose unprecedented challenges on semiconductor wafer fabrication. To better handle and transport 450 mm wafers, an advanced Automated Material Handling System (AMHS) is definitely required. Though conveyor-based AMHS is expected to be suitable for...
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ژورنال
عنوان ژورنال: Journal of the Korean Vacuum Society
سال: 2010
ISSN: 1225-8822
DOI: 10.5757/jkvs.2010.19.3.190